ANSYS热载荷取值大小对仿真结果的影响
你的载荷貌似加的有问题吧,貌似是体生热率,功率密度应该是heat flux。
ansys添加发热功率 ansys怎么加温度
另外载荷值过小,造成温太小,所以第一张图显示不出来吧,可以用/CVAL调节。下面的apdl可以参考参考
fini
我想通过ansys建立一个温电源(Thermoelectric Generator,TEG)模型。
这个问题可以使用稳态的单纯的热分析完全可以解决,你就找一个热的稳态例子,相应地改些东西就可以:
/prep7
esize,0.5
et,1,55 ! 2-D Thermal Solid
rect,0,2,0,1
amesh,1
MP,KXX,,1.0 ! 导热系数
MP,DENS,,10.0 ! 质量密度
MP,C,,100.0 ! 比热
lsel,s,loc,x,0
dl,all,,temp,100 ! 施加温度
alls
lsel,u,loc,x,0 ! 除过刚才选择的那个线
nsll,s,1 ! 选择线上的所有的结点包括关键点Select all nodes (interior to line and at keypoints) associated with the selected lines
sf,all,conv,%cnvtab%,20 ! 结点施加面载荷(对流CONV -convection);使用表格施加载荷方式
alls
/psf,conv,hcoef,2 ! 展列表面载荷的符号show convection bc.film coefficient膜层散热系数
/pnum,tabn,on ! 显示列表的名字;show table names the table name appears
nplot
fini
/solu
anty,static
kbc,1
nsubst,1 ! 指定载荷步的子步数
time,60 ! 载荷步的结束时间
tunif,50 ! 为结点指定一个共同的温度
outres,all,all ! 所有的信息数据写入数据库
solve
finish
/post1
/PLOPTS,INFO,ON ! Legend column on 不在屏幕上显示ANSYS标记 只显示日期
/PLOPTS,LEG1,OFF ! 圆柱图例的一部分
set,last
sflist,all ! 表面载荷的数据都列出来;Numerical values of convection bc's
/pnum,tabn,off ! turn off table name
/psf,conv,hcoef,2 ! show convection bc.
/pnum,sval,1 ! show numerical values of table bc's 应力值
eplot ! convection at t=60 sec.
plns,temp ! Displays element table items as contoured areas along elements.
fini
求ansys移动热源如何建立,求相关实例!!!
给你一个三维平板焊接的实例,用的是移动高斯热源。主要是这一段:
! Begin of equation: Qmexp(-3({X}^2+({Y}-V{TIME})^2)/R^2)
/PREP7
!定义焊接参数
L=1E-1 !焊件的长度
W=1E-1 !焊件的宽度
H=6E-3 !焊件的高度
U=20 !焊接电压
I=160 !焊接电流
V=0.01 !焊接速度
YITA=0.7 !焊接热效率
R=0.007 !电弧有效加热半径
Q=UIYITA !电弧热功率
Qm=3/3.1415/R2Q !加热斑点中心热流密度
!
ET,1,PLANE55
ET,2,SOLID70
MPTEMP,,,,,,,,
MPTEMP,1,20
MPTEMP,2,200
MPTEMP,3,500
MPTEMP,4,750
MPTEMP,5,1000
MPTEMP,6,1500
MPTEMP,7,1700
MPTEMP,8,2500
MPDATA,KXX,1,,50
MPDATA,KXX,1,,47
MPDATA,KXX,1,,40
MPDATA,KXX,1,,27
MPDATA,KXX,1,,30
MPDATA,KXX,1,,35
MPDATA,KXX,1,,40
MPDATA,KXX,1,,55
MPDATA,DENS,1,,7820
MPDATA,DENS,1,,7700
MPDATA,DENS,1,,7610
MPDATA,DENS,1,,7550
MPDATA,DENS,1,,7490
MPDATA,DENS,1,,7350
MPDATA,DENS,1,,7300
MPDATA,DENS,1,,7090
MPDATA,C,1,,460
MPDATA,C,1,,480
MPDATA,C,1,,530
MPDATA,C,1,,675
MPDATA,C,1,,670
MPDATA,C,1,,660
MPDATA,C,1,,780
MPDATA,C,1,,820
MPDATA,EX,1,,2.05E11
MPDATA,EX,1,,1.87E11
MPDATA,EX,1,,1.5E11
MPDATA,EX,1,,0.7E11
MPDATA,EX,1,,0.2E11
MPDATA,EX,1,,0.19E2
MPDATA,EX,1,,0.18E2
MPDATA,EX,1,,0.12e2
MPDATA,PRXY,1,,0.28
MPDATA,PRXY,1,,0.29
MPDATA,PRXY,1,,0.31
MPDATA,PRXY,1,,0.35
MPDATA,PRXY,1,,0.4
MPDATA,PRXY,1,,0.45
MPDATA,PRXY,1,,0.48
MPDATA,PRXY,1,,0.5
UIMP,1,REFT,,,20
MPDATA,ALPX,1,,1.1e-5
MPDATA,ALPX,1,,1.22e-5
MPDATA,ALPX,1,,1.39e-5
MPDATA,ALPX,1,,1.48e-5
MPDATA,ALPX,1,,1.34e-5
MPDATA,ALPX,1,,1.33e-5
MPDATA,ALPX,1,,1.32e-5
MPDATA,ALPX,1,,1.31e-5
TB,BISO,1,6,2,
TBTEMP,20
TBDATA,,220e6,0,,,,
TBTEMP,250
TBDATA,,175e6,0,,,,
TBTEMP,500
TBDATA,,80e6,0,,,,
TBTEMP,750
TBDATA,,40E6,0,,,,
TBTEMP,1000
TBDATA,,10E6,0,,,,
TBTEMP,1500
TBDATA,,1E-5,0,,,,
K,1,0,0,0
K,2,0,L,0
K,3,-W/20.15,L,0
K,4,-W/20.3,L,0
K,5,-W/20.5,L,0
K,6,-W/2,L,0
K,7,-W/2,0,0
K,8,-W/20.5,0,0
K,9,-W/20.3,0,0
K,10,-W/20.15,0,0
K,11,0,0,H
A,1,2,3,10
A,10,3,4,9
A,9,4,5,8
A,8,5,6,7
ESIZE,0.0012
AMESH,1
ESIZE,0.0025
AMESH,2
ESIZE,0.005
AMESH,3
ESIZE,0.0065
AMESH,4
TYPE, 2
EXTOPT,ESIZE,2,0,
EXTOPT,ACLEAR,1
!
EXTOPT,ATTR,1,0,0
REAL,_Z4
ESYS,0
!
VOFFST,1,H, ,
VOFFST,2,H, ,
VOFFST,3,H, ,
VOFFST,4,H, ,
EPLOT
NUMMRG,ALL, , , ,LOW
/SOL
!
ANTYPE,4
!
TRNOPT,FULL
LUMPM,0
DEL,_FNCNAME
DEL,_FNCMTID
DEL,_FNC_C1
DEL,_FNC_C2
DEL,_FNC_C3
DEL,_FNCCSYS
SET,_FNCNAME,'GAOSI'
DIM,_FNC_C1,,1
DIM,_FNC_C2,,1
DIM,_FNC_C3,,1
SET,_FNC_C1(1),QM
SET,_FNC_C2(1),V
SET,_FNC_C3(1),R
SET,_FNCCSYS,0
! /INPUT,HANJIE.func,,,1
DIM,%_FNCNAME%,TABLE,6,19,1,,,,%_FNCCSYS%
!! Begin of equation: Qmexp(-3({X}^2+({Y}-V{TIME})^2)/R^2)
SET,%_FNCNAME%(0,0,1), 0.0, -999
SET,%_FNCNAME%(2,0,1), 0.0
SET,%_FNCNAME%(3,0,1), %_FNC_C1(1)%
SET,%_FNCNAME%(4,0,1), %_FNC_C2(1)%
SET,%_FNCNAME%(5,0,1), %_FNC_C3(1)%
SET,%_FNCNAME%(6,0,1), 0.0
SET,%_FNCNAME%(0,1,1), 1.0, -1, 0, 0, 0, 0, 0
SET,%_FNCNAME%(0,2,1), 0.0, -2, 0, 1, 0, 0, -1
SET,%_FNCNAME%(0,3,1), 0, -3, 0, 1, -1, 2, -2
SET,%_FNCNAME%(0,4,1), 0.0, -1, 0, 3, 0, 0, -3
SET,%_FNCNAME%(0,5,1), 0.0, -2, 0, 1, -3, 3, -1
SET,%_FNCNAME%(0,6,1), 0.0, -1, 0, 2, 0, 0, 2
SET,%_FNCNAME%(0,7,1), 0.0, -3, 0, 1, 2, 17, -1
SET,%_FNCNAME%(0,8,1), 0.0, -1, 0, 1, 18, 3, 1
SET,%_FNCNAME%(0,9,1), 0.0, -4, 0, 1, 3, 2, -1
SET,%_FNCNAME%(0,10,1), 0.0, -1, 0, 2, 0, 0, -4
SET,%_FNCNAME%(0,11,1), 0.0, -5, 0, 1, -4, 17, -1
SET,%_FNCNAME%(0,12,1), 0.0, -1, 0, 1, -3, 1, -5
SET,%_FNCNAME%(0,13,1), 0.0, -3, 0, 1, -2, 3, -1
SET,%_FNCNAME%(0,14,1), 0.0, -1, 0, 2, 0, 0, 19
SET,%_FNCNAME%(0,15,1), 0.0, -2, 0, 1, 19, 17, -1
SET,%_FNCNAME%(0,16,1), 0.0, -1, 0, 1, -3, 4, -2
SET,%_FNCNAME%(0,17,1), 0.0, -1, 7, 1, -1, 0, 0
SET,%_FNCNAME%(0,18,1), 0.0, -2, 0, 1, 17, 3, -1
SET,%_FNCNAME%(0,19,1), 0.0, 99, 0, 1, -2, 0, 0
! End of equation: Qmexp(-3({X}^2+({Y}-V{TIME})^2)/R^2)
TUNIF,20, !定义初始温度
!定义对流换热边界
SFA,15,1,CONV,30,20
SFA,20,1,CONV,30,20
SFA,9,1,CONV,30,20
SFA,14,1,CONV,30,20
SFA,19,1,CONV,30,20
SFA,24,1,CONV,30,20
SFA,23,1,CONV,30,20
SFA,7,1,CONV,30,20
SFA,12,1,CONV,30,20
SFA,17,1,CONV,30,20
SFA,22,1,CONV,30,20
SFA,1,1,CONV,30,20
SFA,2,1,CONV,30,20
SFA,3,1,CONV,30,20
SFA,4,1,CONV,30,20
!施加高斯热源
SFA,5,1,HFLUX, %GAOSI%
SFA,10,1,HFLUX, %GAOSI%
OUTRES,ALL,ALL,
TIME,L/V !设置求解时间
AUTOTS,-1
NSUBST,50,50,50
KBC,0
TSRES,ERASE
LSWRITE,1, !写入载荷文件为1
!
TIME,20
AUTOTS,1
NSUBST,20,20,20
KBC,0
!
TSRES,ERASE
LSWRITE,2,
TIME,50
AUTOTS,1
NSUBST,30,30,30
KBC,0
!
TSRES,ERASE
LSWRITE,3,
TIME,1100
AUTOTS,1
NSUBST,105,105,105
KBC,0
!
TSRES,ERASE
LSWRITE,4,
LSSOLVE,1,4,1, !开始求解
关于ANSYS模拟的请求,知道一块板温度分布,如何利用ansys计算得到它的热导率?跪求
根据公式:q/A=-k dT/dz ,可计算出导热系数。其中,q为热功率,A为导热方向面积,k为材料导热系数,dT为温度变化,dz为导热长度。Ansys软件中一般设定的为热流密度f,即f=q/A,即:f=-k dT/dz , 则k=- dz/dT f
ansys如何计算通电导线的生热率?
电导线的生热率明显涉及两种求解,一个就是通电,导致电学分析,一个就是生热,导致热分析!因此,本人建议使用电热耦合方式来求解,也就是ansys提供的场耦合技术。电热分析有好几类,下面看看:
This ysis, ailable in the ANSYS Multiphysics product, can account for the following thermoelectric effects:
Joule heating - Heating occurs in a conductor carrying an electric current. Joule heat is proportional to the square of the current, and is independent of the current direction.
Seebeck effect - A voltage (Seebeck EMF) is produced in a thermoelectric material by a temperature difference. The induced voltage is proportional to the temperature difference. The proportionality coefficient is know as the Seebeck coefficient (α).
Peltier effect - Cooling or heating occurs at the junction of two dissimilar thermoelectric materials when an electric current flows through the junction. Peltier heat is proportional to the current, and changes sign if the current direction is reversed.
Thomson effect - Heat is absorbed or released in a non-uniformly heated thermoelectric material when electric current flows through it. Thomson heat is proportional to the current, and changes sign if the current direction is reversed.
Typical applications include heating coils, fuses, thermocouples, and thermoelectric coolers and generators. For more information, refer to Thermoelectrics in the Theory Reference for ANSYS and ANSYS Workbench.
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